7MSDP-FA-0019
型號 :
1. MATERIL:
HousIng' LCP UL 94V-0
Contact' C5210-SHm, T: 0.20 mm
Shell' SPCC, T: 0.20 mm
2. PLATING:
Contact : G,F on contact area and Nl over all area for underplated
Mate tin 50u" min in solder tall
Shell : Ni 50u" min in all area
3. Decription:
MICRO SD CONN-1.75H
4. Applications:
