7MSDP-B0-221X
Model :
1. MATERIL:
INSULATOR: HIGH TEMPRATURE THERMOPLASTIC,UL94V-0,BLACK
CONTACT: PHOSPHOR BRONZE
2. PLATING:
CONTACT AREA: 10μ" Au PLATED OVER Ni
SOLDER AREA: Tin PLATED OVER Ni
3. Decription:
Push-Push Connector microSD(support NFC)
4. Applications:
Smart Phone / PDA / MP3、MP4 / GPS / POS / Card Reader / Set-Top Box / DVR
NFC MicroSD( Mobile Payment/Mobile Identity/Security Access Module/Cloud Security/KeyPro
)
Series:
7MSDP-B0-2210 : location pillar
7MSDP-B0-2211 : non location pillar
